pk 544 (v1.0) march 7, 2012 www.xilinx.com 1 pk 5 4 4 ( v 1 . 0 ) march 7 , 201 2 100% material declaration data sheet for ef1136 package average weight: 14.3000 g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 0. 422208 2.953 silicon (si) 7440 - 21 - 3 100.00 basis 0. 422208 bump die 0.0 15498 0. 108 tin (sn) 7440 - 31 - 5 63.00 basis 0.0 09764 lead ( pb) 7439 - 92 - 1 37.00 basis 0.00 5734 solder paste 0.070000 0.490 tin (sn) 7440 - 31 - 5 63.00 metal 0.044100 lead (pb) 7439 - 92 - 1 37.00 metal 0.025900 capacitor 1 0.027520 0. 192 batio3 type 12047 - 27 - 7 80.69 ceramic 0.0 22207 manganese dioxide 1313 - 13 - 9 1.31 ceramic 0.000360 nickel (ni) 7440 - 02 - 0 9.08 internal electrode 0.00 2498 copper (cu) 7440 - 50 - 8 0.68 termination 0.00 0186 boron oxide 1303 - 86 - 2 0.02 termination 0.000004 nickel (ni) 7440 - 02 - 0 7.52 plating 0.002068 tin ( sn) 7440 - 31 - 5 0.6 4 plating 0.000177 lead (pb) 7439 - 92 - 1 0. 0 7 plating 0.000020 capacitor 2 0.072000 0.503 batio3 type 12047 - 27 - 7 88.86 ceramic 0.063977 manganese dioxide 1313 - 13 - 9 1.43 ceramic 0.001029 nickel (ni) 7440 - 02 - 0 4.29 internal electrode 0.00 3086 copper (cu) 7440 - 50 - 8 0.70 termination 0.00 0504 boron oxide 1303 - 86 - 2 0.01 termination 0.000010 nickel (ni) 7440 - 02 - 0 3.57 plating 0.002571 tin (sn) 7440 - 31 - 5 0.90 plating 0.000648 lead (pb) 7439 - 92 - 1 0.24 plating 0.000175 coating 1 0.013200 0.092 silica 7631 - 86 - 9 64.50 basis 0.008514 epoxy resin a 9003 - 36 - 5 22.50 basis 0.002970 epoxy resin b 25068 - 38 - 6 3.00 basis 0.000396 hardener 19900 - 65 - 3 10.00 basis 0.001320 ? copyright 201 2 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet C ef1136 pk 544 (v1.0) march 7, 2012 www.xilinx.com 2 component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total coating 2 0.040000 0.280 polymer resin trade secret 54.50 basis 0.021800 siloxane polymer trade secret 35.00 basis 0.014000 diallyl ether trade secret 5.00 basis 0.002000 silicone trade secret 5.00 basis 0.002000 4, 4' - isopropylidenediphen ol 80 - 5 - 7 0.50 basis 0.000200 underfill 0.065000 0.455 bisphenol f/ epichlorohydrin copolymer 9003 - 36 - 5 20.00 basis 0.013000 phenolic resin trade secret 15.00 basis 0.009750 bisphenol a type liquid epoxy resin 25068 - 38 - 6 5.00 basis 0.003250 amine type accelerator trade secret 5.00 basis 0.003250 silicon dioxide 60676 - 86 - 0 51.50 basis 0.033475 carbon blac k 1333 - 86 - 4 1.00 basis 0.000650 additives trade secret 2.50 additive 0.001625 lid attach adhesive 0.224400 1.569 aluminium oxide al2o3 1344 - 28 - 1 80.00 basis 0.179520 dimethyl siloxane, dimethylvinyl - terminated 68083 - 19 - 2 20.00 basis 0.044880 lid 8 .636600 60.396 copper (cu) 7440 - 50 - 8 99.56 main material 8.598599 nickel (ni) 8049 - 31 - 8 0.44 main material 0.038001 solder ball 1.081241 7.561 tin (sn) 7440 - 31 - 5 63.00 main material 0.681182 lead (pb) 7439 - 92 - 1 3700 main material 0.400059
100% material declaration data sheet C ef1136 pk 544 (v1.0) march 7, 2012 www.xilinx.com 3 substrate 3.632323 25.401 plating copper (cu) 7440 - 50 - 8 33.340 1.211016 nickel (ni) 7786 - 81 - 4 0.460 0.016709 gold (au) 7440 - 57 - 5 0.100 0.003632 copper foil copper (cu) 7440 - 50 - 8 6.770 0.245908 bump tin (sn) 7440 - 31 - 5 0.630 0.022884 lead (pb) 7439 - 92 - 1 0.440 0.015982 resin 65997 - 05 - 9 0.080 0.002906 core bismaleimide triazine resin, epoxy resin 13676 - 54 - 5, 25722 - 66 - 1, 29690 - 82 - 2, 68541 - 56 - 0, 25068 - 38 - 6, na 9.300 0.337806 inorganic filler 13776 - 74 - 4, 7631 - 86 - 9 5.580 0.202684 fiber glass 65997 - 17 - 3 9.300 0.337806 copper (cu) 7440 - 50 - 8 13.020 0.472928 pp bismaleimide triazine resin, epoxy resin, other resin 13676 - 54 - 5, 25722 - 66 - 1, 29690 - 82 - 2, 68541 - 56 - 0, 26265 - 08 - 7, na 1.740 0.063202 inorganic filler trade secret 1.240 0.045041 fiber glass 65997 - 17 - 3 1.980 0.071920 abf n, n - dimethylformamide 68 - 12 - 2 0.150 0.005448 cyclohexanone 108 - 94 - 1 0.740 0.026879 bisphenol a epoxy resi n 25068 - 38 - 6 1.29 0.046857 silica 7631 - 86 - 9 4.460 0.162002 coal tar naphtha 64742 - 94 - 5 0.740 0.026879 toluene 108 - 88 - 3 0.040 0.001453 others n/a 7.440 0.270245 soldermask solvent naphtha 64742 - 94 - 5 0.130 0.004722 naphthalene 91 - 20 - 3 0.020 0.000726 talc 14807 - 96 - 6 0.050 0.001816 morpholine derivative trade secret 0.050 0.001816 silica, amorphou s 7631 - 86 - 9 0.010 0.000363 barium sulfate 7727 - 43 - 7 0.400 0.014529 dipropylene glycol monomethyl ether 34590 - 94 - 8 0.220 0.007991 epoxy resin trade secret 0.170 0.006175 epoxy resin 85954 - 11 - 6 0.100 0.003632
100% material declaration data sheet C ef1136 pk 544 (v1.0) march 7, 2012 www.xilinx.com 4 revision histor y the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and materials suppliers (contractors). all data provided hereunder is based on information received from cont ractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 03 / 0 7 / 201 2 1.0 initial xilinx release.
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